(CYBE) Announces $2.0 Million Follow-On Order for 3D AOI Systems

CyberOptics Corporation (Nasdaq: CYBE) today announced an order valued at approximately $2.0 million for SQ3000 automated optical inspection (AOI) systems, based upon the company’s 3D MRS inspection technology platform. Scheduled for shipment in the first quarter of 2016, this order follows a previously reported $750,000 order for SQ3000 systems that shipped in the fourth quarter of 2015.

Subodh Kulkarni, president and chief executive officer, said: “As evidenced by these recent sizeable orders, our differentiated 3D MRS technology is enabling CyberOptics to gain share in the global AOI market. This order activity reaffirms our confidence in CyberOptics’ future.”

About CyberOptics
CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high precision sensing technology solutions. CyberOptics’ sensors are used in general purpose metrology and 3D scanning, surface mount technology (SMT) and semiconductor markets to significantly improve yields and productivity. By leveraging its leading edge technologies, the company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.

Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; expectations regarding LDI and its impact on our operations; integration risks associated with LDI and other factors set forth in the Company’s filings with the Securities and Exchange Commission.